We present our Indubond® induction bonding technology for the registration of multilayers in the process of manufacturing printed circuits.
News & events
Below we show the latest news, recommendations and promotions related to Indubond, access each one of them to read more.
Winner Innovation Award: InduBond X-Press (category: PCB fabrication), a concept in multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates
From January 25 to 27, 2022 we will be present at IPC Apex 2022 in San Diego, the reference fair for PCB manufacturers in USA. Visit us at All4PCB booth #225
From 16 to 19 November 2021 we will present at Productronica in Munich, the reference fair for PCB manufacturers in Europe.