The InduBond RFX is a machine for registration and bonding multilayer printed circuits. Layer centering and registration are done using a custom high-precision (<10 microns) template.
Layer registration is ensured by induction soldering the layers.
The InduBond RFX also incorporates an automated system of moving heads that makes it possible to quickly solder anywhere on the panel surface. This process has been developed specifically for rigid flexible circuits.
News & events
Below we show the latest news, recommendations and promotions related to Indubond, access each one of them to read more.
Winner Innovation Award: InduBond X-Press (category: PCB fabrication), a concept in multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates
From April 6 to 11, 2024 we will be present at IPC Apex 2024 in Anaheim, California, the reference fair for PCB manufacturers in USA.
From 14 to 17 November 2023 we will present at Productronica in Munich, the reference fair for PCB manufacturers in Europe.