InduBond ® 130N is a registration and induction bonding machine for aligning and soldering a group of inner layers and prepreg that make up a multilayer circuit in the step prior to pressing.
Our system provides repeatability, safety and trustworthiness.
News & events
Below we show the latest news, recommendations and promotions related to Indubond, access each one of them to read more.
From January 29 to 31, 2019 we will be present at IPC Apex 2019 in San Diego, the reference fair for PCB manufacturers in USA. Visit us at All4PCB booth #225
From 12 to 15 November 2019 we will present at Productronica in Munich, the reference fair for PCB manufacturers in Europe.