Indubond 130N
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InduBond ® 130N is a registration and induction bonding machine for aligning and soldering a group of inner layers and prepreg that make up a multilayer circuit in the step prior to pressing. Our system provides repeatability, safety and trustworthiness. |
News & events
Below we show the latest news, recommendations and promotions related to Indubond, access each one of them to read more.
Read moreWinner Innovation Award: InduBond X-Press (category: PCB fabrication), a concept in multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates
Read moreFrom April 6 to 11, 2024 we will be present at IPC Apex 2024 in Anaheim, California, the reference fair for PCB manufacturers in USA.
Read moreFrom 14 to 17 November 2023 we will present at Productronica in Munich, the reference fair for PCB manufacturers in Europe.