HKPCA & IPC Show 2019
HKPCA & IPCShow 2018, The next December 2018 will be held the IPC&APEX South China Show where we will present our Indubond technology.
This event will join thousands of colleagues from more than 50 countries in the most important event of our industry, with the most advanced and emerging technology in design and manufacture of printed circuit board, electronics assembly, testing and printed electronics!.
News & events
Below we show the latest news, recommendations and promotions related to Indubond, access each one of them to read more.
Read moreWinner Innovation Award: InduBond X-Press (category: PCB fabrication), a concept in multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates
Read moreFrom April 6 to 11, 2024 we will be present at IPC Apex 2024 in Anaheim, California, the reference fair for PCB manufacturers in USA.
Read moreFrom 14 to 17 November 2023 we will present at Productronica in Munich, the reference fair for PCB manufacturers in Europe.