HKPCA & IPCShow 2018, The next December 2018 will be held the IPC&APEX South China Show where we will present our Indubond technology.
This event will join thousands of colleagues from more than 50 countries in the most important event of our industry, with the most advanced and emerging technology in design and manufacture of printed circuit board, electronics assembly, testing and printed electronics!.
News & events
Below we show the latest news, recommendations and promotions related to Indubond, access each one of them to read more.
Winner Innovation Award: InduBond X-Press (category: PCB fabrication), a concept in multilayer press technology utilizing electromagnetic energy to heat stainless steel separator plates
From January 25 to 27, 2022 we will be present at IPC Apex 2022 in San Diego, the reference fair for PCB manufacturers in USA. Visit us at All4PCB booth #225
From 16 to 19 November 2021 we will present at Productronica in Munich, the reference fair for PCB manufacturers in Europe.